Reflow soldering isSMTThe step close to the end in the production process of surface mount technology (SMT) processing and responsible for the soldering of components. The defects in reflow soldering are a combination of those in printing and surface mount technology,Including insufficient solder, short circuit, side stand, misalignment, missing parts, multiple parts, wrong parts, reverse side, reverse side, erect monument, crack, solder bead, false soldering, voids, and gloss,Among them, stele standing, cracks, tin beads, false soldering, voids and gloss are the specific defects after soldering. Below is Shenzhen JJYSolder paste manufacturerLet me give you a brief introductionSMTWhat are the common soldering defects in solder paste surface mount processing?

1Erect a monument:The phenomenon where one end of a component leaves the pad and stands upward obliquely or upright;

2Tin connection or short circuit:Solder connection occurs between two or more solder joints that should not be connected,Or the phenomenon of poor connection between the solder at the solder joint and the adjacent wire;

3Displacement and misalignment:The component is laterally within the plane of the pad(Level)Vertical(Vertical)Or the rotation direction deviates from the predetermined position;

4Empty welding:There is no assembly phenomenon where the reflow end of the component is connected to the pad.

5Reverse:The orientation of polar components is incorrect when they are mounted.

6Wrong item:The model and specification of the components mounted at the specified positions do not conform to the requirements.

7"Few pieces":It is required that no materials be mounted at the positions where components are present.

8Exposed copper:PCBAThe green oil on the surface has fallen off or been damaged,  Or the solder paste is not active enough and the solder is not fully covered, resulting in the copper foil being exposed.

9"Bubbling":PCBA/PCBThe deformation of regional expansion occurs on the surface;

10Solder holes: After passing through the furnace, there are phenomena such as blowing holes and pinholes on the solder joints of the components.

11Tin crack: Cracks appear on the tin surface;

12Block the hole:Solder paste remains in the plug-in hole/Screw holes, etc. cause the hole diameter to be blocked;

13Cross one's feet:The pins of multi-pin components are warped and deformed.

14Stand sideways:SMTIn surface mount technology (SMT) processing, the side of the component's soldering end is directly soldered.

15False welding/False welding:The components are not welded firmly,Poor contact may occur under external force or internal stress,Intermittently disconnected and intermittently connected;

16The reverse side/"反白" 可 以 翻 译 为 "reverse white":The surface of the component is silk-screened and adheredPCBThe other side of the board,The product name, specification or font cannot be identified.

17Cold welding/Non-melting tin:The surface of the solder joint is not shiny,The crystallization was not completely melted to achieve a reliable welding effect.

18Less tin:The amount of solder on the component pads is insufficient.

19Multiple items:PCBIt is not required that components be attached to the positions where there are components.

20Tin tip:The tin dots are not smooth,Have sharp peaks or burrs;

21Tin beads:PCBASpherical tin dots or tin substances on it;

22"断路" 可 以 翻 译 为 "Open road":Component orPCBAThe line is disconnected in the middle.

23The component rises:The component body floated and detached after weldingPCBSurface phenomena

JJY Solder Paste Factory specializes in the production of various solder pastes, including leaded solder pastes, lead-free solder pastes, syringe solder pastes, water-washed solder pastes, and zero halogenREACHLead-free high-temperature solder paste, lead-free medium-temperature solder paste, highly reliable lead-free low-temperature solder paste, halogen-free solder pasteLEDSolder pasteQFNSolder pasteBGA/IGBT/MOS/High powerLEDLow-hole solder paste for high-power devices, die bonding solder paste, hardware solder paste, etc.