SMTSolder pasteProcessing is one of the most common surface mount technologies in the electronics industry at present. ThroughSMTTechnology enables the installation of more, smaller and lighter components, enabling circuit boards to meet the requirements of high precision and miniaturization. Sure, this is rightSMTThe technical requirements for surface mount technology (SMT) processing are higher and more complex, so there are many matters that need attention during the operation process. The following is the summary and introduction of Shenzhen JJY Solder Paste Manufacturer:

SMTThe precautions for using solder paste in surface mount technology (SMT) processing are as follows:

1Storage temperature: It is recommended to store in the refrigerator at a temperature of5℃-10℃Please do not lower than0℃.

2Outbound principle: The first-in, first-out principle must be followed. Do not allow solder paste to be stored in the cold storage for too long.

3Thawing requirements: Thaw the solder paste naturally after taking it out of the freezer at least4The bottle cap should not be opened when thawing after one hour.

4Production environment: It is recommended that the workshop temperature be25℃±2℃The relative humidity is45%-65%RHIt should be used under certain conditions.

5Used old solder paste: It is recommended to keep the solder paste after opening the lid12Use it up within hours. If you need to store it, please put it in a clean empty bottle, then seal it and store it back in the freezer.

6The volume of paste on the steel mesh:For the first batch of paste on the steel screen, it is best not to exceed the height of the squeegee when printing and rolling1/2This way, you can observe frequently, increase the frequency more often and the amount less.

Ii.SMTPrecautions for printing operations in surface mount technology:

1Scraper: The material of the scraper is preferably steel scraper, which is conducive to printingPADThe solder paste on it is formed and demolded.

Scraper Angle: For manual printing45-60Degree; Machine printing60Degree.

Printing speed: Manual30mm-45mm/min; Printing press40mm-80mm/min.

Printing environment: The humidity is23℃±3℃Relative humidity45%-65%RH.

2Steel mesh: The thickness of the steel mesh and the shape and proportion of the holes are selected according to the requirements of the product.

QFPCHIPThe center distance is less than0.5mmand0402theCHIPLaser drilling is required.

Steel mesh inspection: A tension test of the steel mesh should be conducted once a week, and the tension value is required to be at35N/cmThat's all.

Clean steel mesh: In continuous printing5-10slicePCBWhen using the board, wipe it once with a dust-free mesh paper. It's best not to use rags.

3Cleaning agent:IPASolvent: It is best to use when cleaning steel meshIPAWhen using alcohol solvents, do not use solvents containing chlorine components, as they will damage the components of the solder paste and affect the overall quality.

JJY owns16With years of experience in research and development and production, we have a strong technical force and stable product quality. Flagship products:QFNHigh solder climbing rate solder paste, zero halogen solder pasteVOIDLow-porosity solder paste, laser solder paste, water-washed solder paste, and high-reliability ones used in military, aerospace, power, photovoltaic and other industriesSn62Pb36Ag2Solder pasteSn62.8Pb36.8Ag0.4Solder paste6337Solder paste, transparent and colorlessLEDHigh-brightness anti-monument solder pastemini-LED/micro-LEDDie bonding solder paste, high-reliability lead-free low-temperature solder paste, low-temperature solder paste for heat sinks, professional solder paste for hardware soldering, lead-free medium-temperature solder paste, lead-free high-temperature solder paste0307/105/305Solder paste, etc. Proprietary technology, strict quality control, continuous stability, making customers worry-free, efficient, cost-effective and competitive!