SMTThe essence of surface mount technology (SMT) is to attach components toPCBAOn the board. SoSMTWhat are the reasons for not applying tin during the surface mount technology (SMT) processing? The following is JJYSolder paste manufacturerLet me give you a brief analysis:

1,PCBASolder pad orSMDThere is a serious oxidation phenomenon at the welding position.

2The activity of the flux in the solder paste is insufficient and has not been completely removedPCBASolder pad orSMDOxidizing substances at the welding position;

3,SMTThe temperature in the reflow soldering area during processing is too low;

4The wetting performance of the flux in the solder paste is not good;

5If there are some solder joints where the solder is not fully coated, it might be that the solder paste was not thoroughly stirred before use, and the flux and solder powder did not fully blend;

6,SMTThe amount of solder paste at the solder joints of the patch is insufficient;

7During reflow soldering, if the preheating time is too long or the preheating temperature is too high, it will cause the flux activity in the solder paste to fail.

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