inSMTDuring the processing and production of surface mount technology (SMT) patches, many undesirable phenomena may occur, one of which is the stele erection phenomenon. The term "erect monument" literally means that electronic components stand upright like tombstones, which is very vivid. That is, when electronic components are printed or surface mount, they will stand upright. Below is Shenzhen JJYSolder paste manufacturerLet me share with you the reasons for the occurrence of monument erection in surface mount technology (SMT) processing:

1The mounting accuracy is insufficient

GenerallySMTIf component offset occurs during surface mount technology, during reflow soldering, due to the surface tension generated by the melting of solder paste, the component can be pulled for automatic positioning, that is, self-alignment. However, if the offset is severe, the difference in tensile force at both ends of the component will be too large, causing the component to stand upright and resulting in a stmonument phenomenon.

2The design of the pad size is unreasonable

IfSMTAsymmetry between the chip component and the pad will cause inconsistent amounts of solder paste printed. Small pads respond quickly to temperature, and the solder paste on the pads is prone to melting, while large pads are the opposite. Therefore, when the solder paste on the small pad melts, if the tensile force difference between the two ends of the same component is too large, the component will stand up, thus causing the stele phenomenon.

3The solder paste was applied too thickly

When the solder paste is too thick, inSMTDuring surface mount technology (SMT) processing, the probability that the solder paste on the two pads cannot melt simultaneously will increase significantly, thereby causing an imbalance in the surface tension at the two solder ends of the component and resulting in a stele phenomenon.

4Insufficient preheating

If the preheating is not sufficient, the probability that the solder paste at both ends of the component cannot melt simultaneously will increase significantly, thereby causing an imbalance in the surface tension at the two solder ends of the component and resulting in a stele phenomenon.

As a 15-year-old veteran solder paste manufacturer, JJY has been committed to the research and development, production and sales of solder paste. The solder paste we produce is of stable quality, without solder connection, false soldering or monument erection. No residue, Wuxi beads, bright, full, firm solder joints with excellent electrical conductivity. If you have any needs, please feel free to contact us.