Solder paste isSMTOne of the commonly used raw materials in surface mount technology (SMT) factories, the appropriate one should be selected based on different products and processesSolder pasteIt can effectively improve the production quality. Below, Shenzhen JJY Solder Paste Manufacturer will briefly introduce to you the common methods for choosing solder paste:

1Solder paste is generally classified into high, medium and low temperature solder paste based on temperature. These need to be combined with the actual number of reflow soldering times of the boardPCBTake into account the temperature requirements of the components comprehensively.

2The cleanliness of the board and the cleaning process after welding are also importantSMTCommon reference factors for choosing solder paste types in surface mount technology (SMT) factories include the use of halogen-free and non-corrosive compound no-cleaning solder paste for no-cleaning processes, solvent-cleaning solder paste for solvent-cleaning processes, and water-cleaning solder paste for water-soluble processes.

3,PCBThe storage time of the components and the degree of surface oxidation are also thereSMTWithin the consideration of the surface mount technology (SMT) factory, it is generally adoptedKJRMAProducts with higher reliability requirements can be selected for this gradeRGrade, it is required for use if it has been stored for a long time or has severe surface oxidationraGrade.

4The particle size of the alloy powder in the solder paste is also a parameter that needs to be selected, and this should be based on the actual situationSMTThe selection is based on the assembly density of surface mount technology (SMT) processing.

5The viscosity of the solder paste should be selected based on the solder paste coating process and assembly density. High-density printing requires a high viscosity, while drop coating requires a low viscosity.

Shenzhen JJY Industrial Technology Co., Ltd. mainly engages in:LEDManufacturers of solder paste, lead-containing solder paste, lead-containing silver-containing solder paste, wave soldering strips, automatic soldering wires, etc.