smtSome defects existing in the factory's surface mount technology (SMT) processing need to be significantly reduced, especiallySMTSome operational errors in surface mount technology (SMT) processing can lead to defects. Identify the causes of the errors and solve them. The following is JJYSolder paste manufacturerLet me introduce some common ones to you allsmtDefects and causes in the surface mount technology (SMT) processing of the factory:

1Short circuit

PCBAThe cause of a short circuit may be adverse reactions such as bridging, or it may be due to the steel mesh andPCBAExcessive board spacing can lead to overly thick solder paste printing and short circuits, or the component mounting height can be set too low, squeezing the solder paste and causing short circuits, solder paste collapse, overly large openings in the steel mesh or excessive thickness, etc.

2Offset

SMTAfter curing, there is a phenomenon of component displacement, and in severe cases, evenSMTThe pins of the components are not on the pads. The reason might bePCBAThe positioning reference points for processing are not clear orPCBAThis phenomenon can also be caused by misalignment of the positioning reference points on the board with those on the steel mesh, faults in the optical positioning system of the printing machine, missed solder paste printing, or mismatch between the openings on the mesh board and the design of the circuit board.

3Missing parts

SMTThere are numerous reasons for missing parts in surface mount technology (SMT) processing, such as poor vacuum pump carbon sheets and insufficient vacuum resulting in missing parts, excessive thickness differences of components,SMTErrors in the parameter Settings of processing machine parts, improper setting of mounting height, etc.

4Erect a monument

The reason for the stele erection phenomenon in surface mount technology (SMT) processing might be that the steel mesh holes are blocked.NOZZLEBlockageFEEDEROffset, excessive spacing between pads, improper temperature setting, etc.

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