The generation of tin slag has its inevitability and regularity. It can be reduced by paying attention to various procedures during the production process. Well,Solder rodHow can tin slag be reduced?The following is a brief discussion by the solder paste manufacturer for everyone:

From the perspective of the operation process, the higher the wave peak, the larger the surface of the solder in contact with the air, the more severe the oxidation will be, and the more tin slag there will be. Therefore, the peak should not be too high and generally should not exceed itpcbIn the thickness direction of the circuit board1/3It is equivalent to saying that the peak of the wave should exceedpcbThe soldering surface of the circuit board, but do not exceed the surface of the electronic components.

If the wave peak is very unstable, when the liquid solder drops back from the peak, it may carry air into the molten solder, causing rapid oxidation of tin in the wave soldering process.pcbThe copper plating on the surface of the circuit board and the copper on the pins of the electronic components are constantly melting into the molten solder. And copper and tin will form with each otherCu6Sn5Intermetallic compound, the melting point of this compound is500℃Therefore, it exists in a solid state. In addition, the current density of this compound is8.28g/cm3AndSn63Pb37The density of the solder rod is8.80g/cm3Therefore, this type of compound will generally appear as tofu residue floating on the surface of liquid solder.

Therefore, the matter of removing copper is very important. The operation process is as follows: Stop the peak, the daily operation of the heating device of the tin furnace, on the one hand, can clean up various residues on the surface of the tin furnace, revealing a mercury-like mirror surface mode. Then lower the working temperature of the tin furnace to190-200℃(At this time, the solder is still in a liquid state)Then stir the solder with an iron spoon or other equipment1-2Minutes help the tin-copper compounds inside the solder to float up and then let it stand3-5About an hour. Because the density of tin-copper compounds is relatively low, they will gradually float on the surface of the solder after being placed. At this point, the tin-copper compounds on the surface can be cleaned up with equipment such as an iron spoon.

The above is a brief introduction on how to reduce solder slag electrodes. I hope it will be helpful to everyone. JJY Solder produces various products such as solder wires, solder pastes, solder bars, lead-free solder bars, eco-friendly solder bars, eco-friendly solder wires, and eco-friendly fluxes. Welcome to inquire.