What does "no cleaning" mean?No-wash solder wireWhat is it? At present, the no-clean soldering process is increasingly widely applied in related fields of the electronics industry. As a supporting process material product for lead-free tin wire, it has also been continuously developed and improved. To ensure that electronic equipment is not cleaned after soldering, soldering has high equivalence and reliability. Now, let's have a look at it with the help of the editor from JJY:
What does "no-clean" mean? After soldering with ordinary solder wire, there is a lot of rosin residue at the edge of the solder joints, and the insulation resistance between the solder joints on the circuit board will decrease. For higher requirements, it needs to be cleaned with board cleaning water. No-clean solder wire has very little residue after soldering and does not need to be cleaned.
Secondly, let's clarify that "no cleaning" and "no cleaning" are two absolutely different concepts. The so-called "no cleaning" refers to the use of traditional rosin flux or organic acid flux in electronic assembly production. Although there are certain residues left on the board surface after soldering, it can still meet the quality requirements of some products without cleaning. Electronic products such as household electronics, audio equipment, mobile phones and office equipment are usually "uncleaned" during production, but they are definitely not "maintenance-free". "No-clean" refers to the situation where electronic components have very little residue after soldering and do not need to be cleaned to achieve the "no-clean" effect.
Here comes the key point: The core reason for the no-wash effect in the no-wash solder wire is that the specially formulated flux in its core plays a decisive role. No-cleaning flux is a new type of flux that does not contain halide active agents and does not require cleaning after soldering. The use of this type of flux not only saves the investment in cleaning equipment and cleaning solvents, but also reduces the pollution to the environment caused by the discharge of waste gas and waste water. Therefore, replacing traditional fluxes with no-cleaning fluxes has significant economic and social benefits.
The new type of no-wash flux is not composed of a single component, but is made up of the following components, each of which has an irreplaceable role, as follows:
1Co-solvent: It prevents the tendency of solid components such as activators to be dissolved from the solution and avoids the poor non-uniform distribution of activators.
2Resins and their derivatives. Here, the resin usually refers to rosin, which can play a very good antioxidant role.
3Surfactants: Mainly nonionic surfactants of fatty acid or aromatic groups,Its main function is to reduce the surface tension generated when the solder and the metal of the lead pin come into contact, enhance the surface wetting force, increase the penetration power of the organic acid activator, and it can also act as a foaming agent.
4Anti-corrosion agent: Reduces the substances remaining after the decomposition of solid components such as resins and activators at high temperatures.
5Organic acid activators: Composed of one or more of the organic acid dicarboxylic acids or aromatic acids, such as succinic acid, glutaric acid, itaconic acid, o-hydroxybenzoic acid, sunflower acid, heptanedioic acid, malic acid, succinic acid, etc. Its main function is to remove the oxides on the lead pins and the surface of the molten solder, and it is one of the key components of the flux.
6Film-forming agent: During the soldering process of lead pins,The coated flux precipitates and crystallizes to form a uniform film,The residue after its high-temperature decomposition, due to the presence of a film-forming agent, can rapidly solidify, harden and reduce viscosity.
7Organic solvents: A mixture of one or more of ketones, alcohols, and esters. Commonly used ones include ethanol, propanol, and butanol. Acetone, toluene isobutyl ketone;Ethyl acetate,Butyl acetate and others, as liquid components, mainly function to dissolve the solid components in the flux, making it form a uniform solution,It is convenient for the components to be soldered to be evenly coated with an appropriate amount of flux components. At the same time, it can also clean light dirt and oil stains on the metal surface.
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