SMTIn surface mount technology (SMT) processing, at both ends of the componentSolder pasteThe melting time and surface tension may vary, which may cause one end of the solder paste to be pulled up in cases of poor printing, different sizes of surface mount or component soldering ends.

In addition, the appropriate length range of the pad design is also very important for avoiding the phenomenon of monument erection. If the outward extension of the welding pad is too short or too long, it may lead to the occurrence of the stele erection phenomenon.

In addition, the thickness of the solder paste application, the composition of the solder paste and its printing parameters are also important factors affecting the phenomenon of monument erection. If the temperature curve is not set properly, especially at the moment when the solder joint begins to melt, the heating rate near the melting point is too fast, which may aggravate the stele erection phenomenon.

In addition, if one of the solder joints of the component is oxidized or contaminated and cannot be moistened, or if the solder pad is contaminated, has silk-screen printing, solder mask ink, has foreign substances adhering to it, or is oxidized, etc., it may also cause thisSMTThere is a phenomenon of monument erection in surface mount technology (SMT) processing.

To solve the problem of setting up steles, the following measures can be taken:

1Design the solder pads reasonably to ensure their extended dimensions are reasonable and avoid the outer edge wetting Angle of the solder pads being larger than45°;

2Select solder paste with higher activity and improve the printing parameters of the solder paste, especially the window size of the template.

3Adjust the parameters of the surface mount machine to ensure that the components are evenly immersed in the solder paste and prevent uneven wetting force on both sides due to time differences.

4Adjust the temperature curve according to each product to ensure that the solder paste is fully melted. YesPCBThe thermal stress of the components is the smallest, and all kinds of soldering defects are the lowest or none.

As a 16-year-old veteran solder paste manufacturer, JJY has been committed to the research and development, production and sales of solder paste. Our product quality is stable, with no solder connection, no false soldering, and no monument erection. Residual Wuxi beads, bright and full solder joints, firm welding, and excellent electrical conductivity. If you have any needs, please feel free to contact us.