Nowadays, society is developing rapidly, and many products require soldering materials. When it comes to this, everyone should be talking about solder paste products. And when it comes to solder paste, there are different products, which are divided into high-temperature solder paste and low-temperature solder paste. What are the differences between the two? The types of solder used are also different. Now, let's have a brief discussion with JJY solder Paste Manufacturer:

The main real difference between high-temperature solder paste and low-temperature solder paste lies in that for some chips, the temperature cannot be too high when passing through the furnace; if it is too high, bubbles will form. However, for low-temperature solder paste, if some vibration slots are added after the temperature is generated (relatively low), problems may occur. High-temperature solder paste is generally used in applications that generate less heatSMTComponents: Some components generate a lot of heat. If low-temperature solder paste is applied, the solder will melt. Coupled with mechanical vibration and other environmental factors, the components will crack.

Characteristics of high-temperature solder paste:

1It has good printing rolling property and tinning property, and is suitable for low to0.3mmThe pitch pads can also achieve precise printing;

2When printing continuously, its viscosity changes extremely little, and the operational life of the steel screen is long, exceeding8It will not dry out even after hours and still maintain a good printing effect.

3The solder paste remains in its original shape for several hours after printing without collapse, and the surface mount components will not shift.

4It has excellent welding performance and can exhibit appropriate wettability in different parts.

5It can meet the requirements of welding equipment of different grades, does not need to complete welding in a nitrogen-filled environment, and still shows good welding performance within a wide range of reflow oven temperatures.

6After high-temperature solder paste soldering, there is very little residue, it is colorless and has a high insulation resistance. It will not corrode and can meet the requirement of no cleaning.

7It has betterICTTest performance and there will be no misjudgment.

8It can be used for coating through hole rollers.Paste in hole"Process;"

9The melting point of tin-silver-copper solder paste is relatively high, and it has high requirements for the furnace. However, the soldering effect of tin-silver-copper solder paste is excellent, with high mechanical strength, less rosin residue, and it is white and transparent. When printing high-temperature solder paste, it has good moisture retention, can achieve stable printability, has excellent demolding performance, and can be continuously printed on steel screens8When it is small, it has good solderability, good solder climbing, and full and bright solder joints.

Low-temperature solder paste is mostly used in the second reflow of the double-sided reflow soldering process. This is because the first reflow surface has larger components. When the same melting point solder paste is used in the second reflow, it is easy for the large components on the first reflow surface (which is inverted during the second reflow) that have been soldered to have false soldering or even fall off. Therefore, low-temperature solder paste is generally used in the second reflow. When it reaches the melting point, the solder on the first reflow surface will not undergo secondary melting.

Characteristics of low-temperature solder paste:

1Melting point138℃

2Completely in line withRoHSStandard

3Excellent printability, eliminating omissions, depressions and fast formation during the printing process

4It has good wettability and the weld points are bright, uniform and full

5During reflow soldering, solder beads and solder Bridges are produced

6It has a long bonding life and a long printing life of steel mesh

7It is suitable for a wide range of manufacturing processes and rapid printing

In ourSMTLead is generally used in surface mount technology (SMT) processing6337Or lead-free high-temperature solder paste, medium-temperature solder paste for cardboard sheets;LEDWhen it comes to aluminum substrate plates, they have high powerLEDUse low temperature.T5T8Fluorescent lamps use high temperatures more often than medium temperatures.LEDSoft board sheetMPCHigh-temperature solder paste should be used for the board. Medium and low-temperature solder paste cannot be used because it is much more likely to fall off. Radiators are mostly used at low temperatures, while high-frequency heads are used at medium temperatures.

If you need to purchaseLow-temperature solder pasteOr for high-temperature solder paste, you can consult the customer service staff. They will recommend high-quality, cost-effective solder paste products for you. Good quality and excellent service are our advantages! Welcome new and old customers to call for consultation and purchase!?