In the electronics industrySolder wireIt should be one of the most common auxiliary materials. During production, there are usually some situations such as tin explosion or tin coating during the operation. The main reason for this is usually the structure of the solder wire. Only by recognizing this can the problem be truly solved. When soldering, if the high-temperature soldering iron tip touches the solder wire, The flux inside the solder wire will melt rapidly, generating a large number of bubbles that burst. Since the solder wire pipeline is sealed, the large number of bubbles produced cause high pressure. When the pressure exceeds the pressure of the pipeline, the solder will be blown away, thus causing an explosion. Below, the solder paste manufacturer will explain how to prevent it:
I. The main reasons are:
The problem of moisture absorption: Due to the presence of moisture in the air, especially during the spring rainy season, particularly in the humid weather of Guangdong, solder wires (solder wires) or circuit boards may become damp and retain moisture on the surface due to improper or inadequate storage, which can cause intermittent solder cracking or explosion.
Problems in tin wire processing: During the production of solder wire, if there are cracks in the solder wire (tin wire) when passing through the wire drawing machine, the drawing oil will seep in through the cracks, which can also cause the occurrence of tin explosion during the soldering operation.
Ii. Preventive Measures:
1Strengthen storage measures to prevent moisture. Control temperature and humidity, and create a dry storage or working environment.
2During the production process of solder wire, strengthen inspection and control to prevent cracked solder wire from entering the wire drawing stage. If any are found, the cracked parts should be cut off for disposal.
3Strengthen the random inspection of semi-finished and finished products.
4In case of damp or continuous heavy rain, before the welding operation, please dry the plates to be welded to remove the moisture from the air on the surface of the plate pads.
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