High-temperature solder pasteIn what environment does it work best? When it comes to high-temperature solder paste, like many people, I would also think of low-temperature solder paste. The main difference lies in that some chips cannot be heated at a high temperature when passing through the furnace. The melting points of high-temperature lead-free solder paste and low-temperature solder paste are different. Solder paste can also be divided into two major categories: lead-free solder paste and leaded solder paste. The following is a summary made by JJY Solder Paste Manufacturer and Soldering Factory mainly regarding the environment in which high-temperature solder paste works best:

Lead is generally used6337Or lead-free high-temperature solder paste, medium-temperature solder paste for cardboard sheets;LED For aluminum-based plates, it has high powerLEDOnly use low temperatureT5T8Fluorescent lamps use high temperatures more often than medium temperatures.LEDSoft board sheetMPCOnly high-temperature solder paste should be used for the board. Medium and low-temperature solder paste should not be used because it is very easy for the components to fall off. Radiators are mostly used at low temperatures, while high-frequency heads are used at medium temperatures.

1The humidity and ambient temperature during the operation of high-temperature solder paste are also extremely important. Therefore, it is recommended that the room temperature of the working environment be between 23 and 25 degrees Celsius, and the humidity be 60%. The viscosity of the solder paste can be adjusted to an appropriate level between 23 and 25 degrees. Therefore, if the temperature is too high, the viscosity will be too low. If the temperature is too low, the viscosity will be too high, which will prevent the printing from achieving a perfect effect. Due to the hygroscopicity of solder paste, in a high-temperature and humid environment, the solder paste will absorb moisture from the air, resulting in solder balls and spatter.

2During the surface mount operation, if the solder paste is blown by the wind, the solvent will evaporate, causing the viscosity to decrease and the surface layer to open. Therefore, during the operation process, it is necessary to avoid direct blowing of air conditioners or electric fans on the solder paste as much as possible.

3High-temperature solder paste or other solder pastesSMTAfter surface mount printing, it should be reflow soldered within four hours. If it is left for too long, the solvent will evaporate, the viscosity will decrease, and the solderability of the parts will deteriorate, or the solder balls that have absorbed moisture will form. Especially for circuit boards with silver conductors, if the solder paste is printed in a high-temperature and high-humidity environment with a room temperature of 30 degrees and a humidity of 80%, and then placed aside, the soldering force after reflow will become extremely low.