inSMTIn the electronics industry, solder paste is widely used in the soldering process of electronic circuit boards. Which brand of solder paste is good to use on the market now? We all know that there are many brands of solder paste, and most of them have different formulas. It is not easy to choose better solder paste. Of course, most of the well-known brands in the market are foreign ones, with good quality but relatively high costs. The following solder paste manufacturer explains some features in this regard: Halogen-free and lead-free solder paste has the following characteristics:1Wettability......
Details >
inSMTIn the process, solder paste printing is an extremely important procedure. If the solder paste printer has printing deviations, it is highly likely to cause a large amount of solder to be applied, affecting the quality of the finished product and causing economic losses. Today, the solder paste manufacturer will share how to deal with the printing offset of the solder paste printer?SMTThe main reasons for deviations in solder paste printing are usually:1If the positioning points are not accurately identified, it will cause deviations in solder paste printing.2Due to incorrect coordinates, the solder paste printing has shifted. It is necessary......
Details >
LEDDie bonding solder paste not only has a high thermal conductivity, low resistance and fast heat transfer, but also can meet the requirementsLEDThe heat dissipation requirements of the chip, as well as the stable quality of the surface mount and high mechanical strength of the soldering, can effectively ensure the reliability of die bonding. The solder paste manufacturer briefly discusses the specific characteristic parameters: Thermal conductivity: The main alloy of die bonding solder pasteSAgCuThe thermal conductivity of is approximately67W/m·KIt has low resistance and fast heat transfer, which can meet the requirementsLEDThe heat dissipation requirements for chips (generally, the thermal conductivity of silver glue is usually.1.5-25W/m·K......
Details >
During the solder paste printing process, electronic components may fall off. In such a situation, how should it be solved? Now, the solder paste manufacturer will talk about some issues in this regard:SMTAnalysis of the Causes of False Soldering of Printed Solder Paste1Generally speaking, the occurrence of false soldering may be due to insufficient solder or too many parts, or it may be caused by insufficient activity of solder paste or insufficient nitrogen concentration in the reflow soldering oven.2Check whether there are any defects in the components, solder paste and operation process.3Inspect the solder paste printing machine equipment......
Details >
1.QFPSome of the solder joints on the front of the circuit board deteriorated when exposed to heat for the second timeQFPThe pins are first stabilized by reflow soldering with lead-free solder paste. There are adverse phenomena such as melting and falling off (people on the reverse side of the secondary reflux circuit board will be even worse).QFPEspecially near high-temperature tin fillingPTHThe pins are prone to hot cracking and floating because during wave soldering, the amount of solder and heat jump from the bottom to the top (the larger the pore size, the more severe the loss), which will cause nearbySMTThe pins soften and the pin stress enables them to reach201°C......
Details >
SHENZHEN JIAJINYUAN INDUSTRIAL TECHNOLOGY CO., LTD.
Tel：+86 0755 88366766
Phone：+86 18938660310
Email：sales@jjyhanxi.com
Address：13/F,12/F, Building No. B,Qinghu Technology Park,Qingxiang Rd.,Qinghu Community, Longhua Subdistrict,Longhua District,Shenzhen City,GUANGDONG Province,P.R.C.(518027)
Guangdong Public Security Backup 44030902002666 name
WeChat
WeChat official account
