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How to choose a suitable solder paste in SMT assembly?

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inSMTIn surface mount processing, solder paste is widely used inPCBAAssemblyPCBAManufacturing and all kinds ofSMTIn the process, forPCBAThe quality of the finished product plays a decisive role. Solder paste is a kind of soldering material,…

Industry News

JJY | What are the features and advantages of low-temperature solder paste?

JJY | What are the features and advantages of low-temperature solder paste?Jul 22,2024

AccompaniedSMTThe development of technology andLEDThe advancement of the industry has led to an increasing demand for low-temperature solder paste. Previously, JJY solder Paste Manufacturer analyzed the differences between high and low temperature solder pastes and their respective application scopes for everyone. Here, we will give you a simple popular science introduction. The main difference between high and low temperature solder paste lies in this "temperature". Some chips orPCBSurface mount components cannot withstand it200℃When the temperature is above and the surface mount reflow process is required, low-temperature solder paste should be used for soldering. In this way......

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【 JJY 】 Why do bubbles appear after reflow soldering of solder paste on circuit boards?

【 JJY 】 Why do bubbles appear after reflow soldering of solder paste on circuit boards?Jul 18,2024

Sometimes, after reflow soldering of the solder paste on the circuit board, foaming may occur. What causes this? The fundamental reason lies in the presence of gas or water vapor between the base material and the solder mask film. Trace amounts of gas or water vapor can be carried in along with different technological processes. When exposed to high temperatures, gas expansion causes the base material to delaminate from the solder mask film. During welding, due to the high temperature of the solder pad, bubbles usually appear around the solder pad first. Next, JJY solder paste......

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How to solve the problem of poor tin creep in QFN? -SMT solder paste

How to solve the problem of poor tin creep in QFN? -SMT solder pasteJul 16,2024

QFNPackaged chipICSoldering the side pins is a big problem. We often encounter some customer feedback:qfHow to solve the problem of poor tin climbing?qfHow is the standard soldering height for chip pins determined?qfIs there no tin crawling on the side? Now, let's have Shenzhen JJY Solder Paste Manufacturer explain: 1.QFNDuring the reflow soldering process, the flow direction of the molten solder paste is mainly influenced by gravity and the intermolecular attraction forces after wetting the base material, aiming to achieve solder crawling......

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What are the key points for solder paste control during the SMT soldering process?

What are the key points for solder paste control during the SMT soldering process?Jul 15,2024

SMTDuring the soldering process, whether it is output, time or quality, all need to be controlled within a certain range. Solder paste is a key factor in quality control. So, how can we better manage solder paste? Now, Shenzhen JJY Solder Paste Manufacturer will introduce it to you:1When storing solder paste, the temperature of the refrigerator needs to be controlled at0to10℃Between them, the solder paste is there5℃The shelf life is about six months, and the thermometer needs to be calibrated every six months2The solder paste flows in sequence......

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What are the factors that cause solder beads to appear in SMT solder paste soldering?

What are the factors that cause solder beads to appear in SMT solder paste soldering?Jul 12,2024

inSMTDuring the solder paste soldering process, the solder bead phenomenon is one of the main defects. There are many reasons for the formation of tin beads, and they are not easy to control. Then it leads toSMTWhat are the factors that cause tin beads to appear during welding? Now, let's take a look at the introduction from Shenzhen JJY Solder Paste Manufacturer:1InSMTDuring the production process, the solder paste used should have an appropriate squeezing force to ensure it is evenly distributed on the pads. Unstable squeezing force may lead to the formation of tin beads.2The problem of solder beads is related to the design of the solder pads. welding......

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