What are the advantages and disadvantages of low-temperature solder paste? The main reason for the application of low-temperature solder paste is that the product design cannot withstand the conventional temperature requirements and uses low-temperature solder paste for the soldering process. It serves to protect the components that cannot withstand high-temperature reflow solderingPCBVery much.LEDIt is welcomed by the industry. Its alloy composition is tin-bismuth alloy. The peak temperature of reflow soldering for low-temperature solder paste is170-200℃. Low-temperature flux paste is a no-clean type of flux designed for the current rapid welding production process......
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How can the impact of solder paste splashing be minimized? Generally, in the production process of solder paste, waste is inevitable, which means issues related to the quality and reliability of the product as well as the manufacturing process. Other types include water stain contamination and flux splashing. These effects are relatively minor, but due to solder spatter, the solder has actually wetted the surface of the "gold finger". Now, let's have JJY solder Paste Manufacturer explain to you: There are many reasons for solder spatter, and it's not necessarily reflow soldering......
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What are the differences between no-rinse solder paste and washable solder paste?What are the advantages of no-rinse solder paste?Generally speaking, these two types are basically not used. However, if solder paste needs to be cleaned, there are two ways: one is to clean it with water, and the other is to use no-clean solder paste. The two are different. It is precisely because of this situation that everyone should pay attention to which one is relatively better. And some of the flux pastes in common solder paste contain sulfuric acid. It is very easy to solder the contact circuit board and pins, etc......
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Common problems in the lead-free solder paste printing process? Solder paste printing. First, check whether the parameter Settings of the solder paste printer are correct.PCBAll the solder paste is printed on the pad. Whether the height of the solder paste is uniform or in a "trapezoidal" shape, the edge of the solder paste should not have rounded corners or a collapsed pile shape. In the flow back soldering process of surface mount mounting, the solder paste is used to connect the pins or terminals of surface mount components with the middle of the solder layer. In the process of printing solder paste, the substrate is placed......
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What is the granular state after lead-free solder paste soldering and why is it not smooth? The transformation of market demands drives the reform and development of the field, and scientific research and product development technology drive the new upgrading of the industrial chain in the future. When many people apply the heavy metal-free solder paste surface mount technology, they find that the circuit boards after soldering have granular conditions, are not very smooth, and appear granular. What's going on here?Today, JJY Enterprise will share with you the key factors that cause unevenness after lead-free solder paste soldering are as follows......
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