Application Report of Low-temperature Solder paste process: The current low-temperature solder paste is generallyS-BiSeries, includingSBi,SBiAg,SBiCuAmong various alloy components, etcS42Bi58It is an eutectic alloy, and its melting point is138℃The other alloy components all have no eutectic points and their melting points are also different.S42Bi58The crystallization of this alloy is in a flaky structure, meaning that the weld points are prone to brittle cracking. Therefore, it is not suitable for products with general strength requirements. After adding the third element, the crystalline structure changes and the strength......
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Welding wire, also known as solder wire, is one of the indispensable auxiliary materials in the soldering of electronic products. The proper application of solder wire can reasonably enhance its working efficiency. That is to say, the use of solder wire is very crucial. Factors such as improper use or differences in processing techniques, which are external forces, all contribute to the welding effect of solder wire. Now, JJY Tin Factory will give you a brief introduction: The reasons for the fatigue failure of solder wire solder joints: The transportation of the goods after installation shall be handled by the calendar......
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inSMTIn the production and processing of wafers, solder paste is an indispensable processing material. Solder, also known as solder paste, isSMTPatch is mainly applied inSMTA new type of soldering material for surface patches, generally composed of soldering powder, flux, other surfactants and thixotropic agents. Different solder pastes can vary. Everyone can take a look: (1The grade of solder paste should be selected based on the value and application of the electronic product itself. Products with high reliability requirements should use high-quality solder paste. when......
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How to solve the problem of bubbling after lead-free solder paste application? When everyone is working with lead-free solder paste, there are always many problems of bubbling. Solder joint bubbles not only undermine the stability of solder joints but also continuously increase the probability of component failure. When using lead-free solder paste, the bubbles in the solder joints serve as heat storage sites during the operation of electronic devices. The heat generated by the operation of electronic devices can cause bubbles. So, how should such a situation be solved? Let's have a look with the help of the editor from JJY Solder Paste Factory......
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What should I do if the solder paste becomes "hard"? The weather is getting colder and colder now. In some cases, due to the formula and manufacturer, solder paste is prone to evaporation. If lead-free solder paste only hardens, it can still be used. If lead-free solder paste becomes dry, it can be mixed and stirred with new lead-free solder paste in the corresponding proportion for use. An appropriate amount of flux paste can also be added because it contains surfactants. It can enable lead-free solder paste to fully exert its soldering function. Countermeasures after solder paste becomes "hard" :1.......
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