Grape ball phenomenonGraig), generally refers to inmtDuring the surface mount technology (SMT) process, some of the solder paste was not completely melted during the reflow soldering process. Instead, they were soldered together to form individual solder beads or balls stacked together, creating a phenomenon similar to bunches of grapes. Now, Shenzhen JJY Solder Paste Manufacturer will take you to understand the main causes of grape ball formation and the preventive measures: 1. The main possible causes of grape ball formation1Wave the flux in the solder paste in advance......
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SMTIt is a commonly used technology in modern electronic manufacturing. It can make the circuit design more streamlined, the soldering speed faster and the cost lower. However,SMTThere are also adverse phenomena in surface mount soldering, which can affect the performance and quality of electronic products. To prevent these negative phenomena from occurring, it is necessary to have a clear train of thought to analyze the negative issues step by step in order to solve the fundamental problems. Next, Shenzhen JJY Solder Paste Manufacturer will analyze it for everyoneSMTstick......
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inmtDuring processing, many customers usually have requirements for the glossiness of reflow solder joints. The quality of solder joints directly affects the service life and reliability of electronic products. However, during the reflow soldering process, it cannot be guaranteed that the glossiness of each reflow solder joint meets the requirements. So, what are the reasons for the insufficient glossiness of reflow solder joints?Now, Shenzhen JJY Solder Paste Manufacturer will take you to learn about it:The main factors affecting the glossiness of reflow solder joints1Solder paste ingredients......
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inSMTDuring surface mount technology (SMT) processing, there is sometimes a phenomenon where the ends of components are lifted up, known as a "monument", which affects the quality and performance of the product. The fundamental cause of this "monument" is the imbalance of wetting forces at both ends of the component, resulting in an imbalance of torque at both ends and causing the component to tilt. The following is the reason for the occurrence of monument erection and the corresponding solutions shared by Shenzhen JJY Solder Paste Manufacturer: 1. Analysis of the causes of monument erection1The load-bearing capacity at both ends of the components is uneven, and the tin content is inconsistent.2......
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Solder paste printing isSMTThis is a very important process step in the manufacturing process. Many problems with poor soldering occur at this stage. During the process of printing solder paste, due to human operational errors, such as placing the circuit board in reverse or misalignment the steel mesh with the circuit board, solder paste can be mistakenly printed on the circuit board. So, what should be done in such a situation? Below, Shenzhen JJY Solder Paste Manufacturer will briefly introduce to you the commonly used methods for cleaning solder paste:After the solder paste was mistakenly printed, many people came first......
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