During the production and processing in Shenzhen's surface mount technology (SMT) processing factories, sometimes due to various reasons, some poor production and processing phenomena occur, and solder beads are one of the more common ones, mainly manifested in the completionSMTAfter surface mount processing, small spherical or point-like solder may appear on the solder pads or other places. If not dealt with in a timely manner as required by production, it may affect the service life and reliability of the board. Now, Shenzhen JJY Solder Paste Factory will give you a brief introduction to the common ones......
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SMTIn the production process of the processing plant, solder paste is one of the important raw materials for production, and its main use is to connect components andPCBWhen soldering together, the characteristics of the solder paste and the content of alloy components in its composition, the particle size of the alloy powder, the particle shape, and the temperature are all related. inSMTDuring the use of solder paste in processing plants, the temperature in the workshop is usually controlled at23℃±3℃The relative humidity isRH45%~70%And it is required to have a dust-free environment and no corrosive gases in the air. Below is Shenzhen Jiajin Yuanxi......
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SMTDuring surface mount technology (SMT) processing, there may be differences in the melting time and surface tension of the solder paste at both ends of the component. This may cause one end of the solder paste to be lifted when the printing is poor, or when the sizes of the SMT or component soldering ends are different. In addition, the appropriate length range of the pad design is also very important for avoiding the phenomenon of monument erection. If the outward extension of the welding pad is too short or too long, it may lead to the occurrence of the stele erection phenomenon. In addition, the coating thickness of the solder paste, the composition of the solder paste and its printing parameters are also included......
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inSMTIn the process of surface mount technology (SMT) processing, soldering and tin application is a crucial stage, which is related to the performance indicators and aesthetic appearance of the circuit board. During actual production, poor tin application may occur due to some reasons, such as the common spot soldering and tin application not being smooth, which can directly affect the situationSMTThe quality of surface mount technology (SMT) processing. Below, Shenzhen JJY Solder Paste Manufacturer will provide a detailed introduction for everyoneSMTThe reasons for the solder not being smooth during spot soldering in surface mount technology processing:SMTThe solder on the spot soldering in the surface mount processing is not smooth......
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SMTProcessing holds an important position in the electronics manufacturing industry, and it is achieved throughSMTSurface mount technology and other processes will transform the original printed circuit boardPCBIt is transformed into finished electronic products. inSMTDuring processing, leaded and lead-free welding techniques are two types of welding processes, which have different impacts on product performance and reliability. Next, Shenzhen JJY Solder Paste Manufacturer will explainPCBAThe difference between lead-containing and lead-free solder paste in processing: Lead-containing solder paste mainly uses metals containing tin and lead as materials. Common lead-containing components areS63P37The melting point is......
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SHENZHEN JIAJINYUAN INDUSTRIAL TECHNOLOGY CO., LTD.
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