Sometimes, after reflow soldering of the solder paste on the circuit board, foaming may occur. What causes this? The fundamental reason lies in the presence of gas or water vapor between the base material and the solder mask film. Trace amounts of gas or water vapor can be carried in along with different technological processes. When exposed to high temperatures, gas expansion causes the base material to delaminate from the solder mask film. During welding, due to the high temperature of the solder pad, bubbles usually appear around the solder pad first. Next, JJY solder paste......
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QFNPackaged chipICSoldering the side pins is a big problem. We often encounter some customer feedback:qfHow to solve the problem of poor tin climbing?qfHow is the standard soldering height for chip pins determined?qfIs there no tin crawling on the side? Now, let's have Shenzhen JJY Solder Paste Manufacturer explain: 1.QFNDuring the reflow soldering process, the flow direction of the molten solder paste is mainly influenced by gravity and the intermolecular attraction forces after wetting the base material, aiming to achieve solder crawling......
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SMTDuring the soldering process, whether it is output, time or quality, all need to be controlled within a certain range. Solder paste is a key factor in quality control. So, how can we better manage solder paste? Now, Shenzhen JJY Solder Paste Manufacturer will introduce it to you:1When storing solder paste, the temperature of the refrigerator needs to be controlled at0to10℃Between them, the solder paste is there5℃The shelf life is about six months, and the thermometer needs to be calibrated every six months2The solder paste flows in sequence......
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inSMTDuring the solder paste soldering process, the solder bead phenomenon is one of the main defects. There are many reasons for the formation of tin beads, and they are not easy to control. Then it leads toSMTWhat are the factors that cause tin beads to appear during welding? Now, let's take a look at the introduction from Shenzhen JJY Solder Paste Manufacturer:1InSMTDuring the production process, the solder paste used should have an appropriate squeezing force to ensure it is evenly distributed on the pads. Unstable squeezing force may lead to the formation of tin beads.2The problem of solder beads is related to the design of the solder pads. welding......
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Recently, a customer inquired about what to do if they found the solder paste was a bit thin during the soldering process. If the solder paste is too thin, it may result in the inability to obtain good solder joint quality during the soldering process. Today, Shenzhen JJY Solder Paste Manufacturer will briefly introduce to you several temporary solutions as follows:1Stir and mix. Use a stirring rod or a dedicated solder paste mixer to thoroughly stir and mix the solder paste. This helps to evenly disperse the metal particles in it, making it more viscous, but during the stirring process......
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