LEDDiebondingsolderpastenotonlyhasahighthermalconductivity,lowresistanceandfastheattransfer,butalsocanmeettherequirementsLEDTheheatdissipationrequirementsofthechip,aswellasthestablequalityofthesurfacemountandhighmechanicalstrengthofthesoldering,caneffectivelyensurethereliabilityofdiebonding.Thesolderpastemanufacturerbrieflydiscussesthespecificcharacteristicparameters:Thermalconductivity:ThemainalloyofdiebondingsolderpasteSAgCuThethermalconductivityofisapproximately67W/m·KIthaslowresistanceandfastheattransfer,whichcanmeettherequirementsLEDTheheatdissipationrequirementsforchips(generally,thethermalconductivityofsilverglueisusually.1.5-25W/m·K......
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